Electronic homework is the earliest and most widely used cleaning operation of ultrasonic cleaner. The cleaning of electronic parts: electronic parts, such as the shell of semiconductor tube, the shell of IC, the shell of crystal, the housing of relay, the electronic tube holder, etc. The matrix cleaning of the electronic components of the ultrasonic cleaner: the matrix of the electronic components is made of semiconductor materials and encapsulated in metal or plastic pedestal. Before encapsulation, it is necessary not only to clean the shell seat, but also to clean the matrix, such as IC chip, resistance, crystal, semiconductor, original film circuit and so on. .
The cleaning of PCB board by ultrasonic cleaner: in our country's electronic operation, most of the companies are using PCB. The welding flux used in PCB component welding is divided into three kinds: water soluble, rosin and clean type. More use is used as the first two, and more ultrasonic cleaning machines are selected. The clean type principle should not be clean, but the world is not clean, but the world is not clean. Most manufacturers in the world still need cleanliness even if they choose clean welding flux.
In particular, high density PCB and high density IC feet are not clean or clean with ultrasonic cleaners, which will cause dust between high density lines and IC feet. Once the humidity is large, it is easy to have defects between high density lines and short circuits between feet, and the short circuit defects are out of sight once the environment is monotonous. This kind of defect is not easy to find. Therefore, all electronic factories in the world insist on ultrasonic cleaning of PCB panels. In our country, the military electronic factory has begun to implement, and has received two levels of benefits, which not only improve the reliability of goods, but also reduce the cost of after-sales service.
In the production of connector, connector, adapter and other devices, it is necessary to clean the ultrasonic cleaner before electroplating and assembling. Otherwise, the dust and oil adsorbed on these parts will affect its conductivity and insulation function, especially some disordered multi core connectors, especially such.
After processing and molding of electronic data, such as chip, silicon chip, piezoelectric ceramic and other electronic data is the goods supplied by the manufacturer of the components, its goods are necessary to clean before leaving the factory, especially for the manufacturers of oral affairs. The cleaning of the goods has become a big problem, and the cleaning of ultrasonic cleaners is the most useful way.